A very important step in silicon wafer production is the Chemical Mechanical Planarization (CMP) process. The trend is towards larger wafer sizes, smaller chips with narrower line widths and feature sizes. The challenge is to find a material with the desired characteristics, as the CMP process requires components made of highly qualified materials. In close cooperation with customers, we have specialised in developing materials that meet these requirements For continuous plating of point-to-point terminals, the thickness and height of the plated layer can be precisely controlled by the PEEK selector ring, resulting in significant savings in gold loss.

PEEK is widely used on consumer electronics, home appliances and semiconductor products for electronic industry. PEEK polymers can withstand continuous use high temperatures and harsh chemicals, modified peek provide a range of electrically conductive, anti-static or static dissipative properties, these characteristics are important for semi-conductor applications such as vacuum traceless sucker.

JUNDE PEEK solution to suit every environment and meets the strictest requirements, based components have a proven cost less than traditional materials, such as replacing metal with integrated PEEK components can improve energy efficiency in appliances up to 2% by weight reduction, help increase fab productivity up to 3% with longer lifetime than PPS.

Team up with JUNDE PEEK to address your challenges in the ever-changing electronics industry.